List of fellows of IEEE Components, Packaging & Manufacturing Technology Society
The Fellow grade of membership is the highest level of membership, and cannot be applied for directly by the member – instead the candidate must be nominated by others. This grade of membership is conferred by the IEEE Board of Directors in recognition of a high level of demonstrated extraordinary accomplishment.[1]
| Year | Fellow | Citation |
|---|---|---|
| 2005 | Duane Boning | For contributions to modeling and control in semiconductor manufacturing |
| 2003 | Sreejit Chakravarty | For contributions to high volume manufacturing testing of VLSI circuits |
| 2014 | Manuel Dabreu[2] | For contributions to the design of resilient manufacturing processes for electronic products |
| 2010 | Andrew Kahng | For contributions to the design for manufacturability of integrated circuits, and the technology roadmap of semiconductors |
| 2017 | Frank Liu | For contributions to design for manufacturability of VLSI circuits |
| 2006 | Gary May | For contributions to semiconductor manufacturing and engineering education |
| 2014 | Zhigang Pan | For contributions to design for manufacturability in integrated circuits |
| 2017 | William Regli | For contributions to 3D search, design repositories and intelligent manufacturing |
| 1997 | W Trybula | For contributions in developing and advancing electronics manufacturing technology |
See also[edit]
References[edit]
- ^ "IEEE Fellows Directory".
- ^ "2014 elevated fellow". IEEE Fellows Directory.